Senior Packaging Engineer

At Omnitron Sensors, our team of award-winning industry veterans is pioneering the next generation of MEMS devices. We went outside the box to change how MEMS are made so you can take a gigantic leap in product performance and capabilities. We’re out to impact every part of the sensor ecosystem, bringing Omnitron’s platform to the forefront of sensor development.

We do things differently. We challenge conventional thinking and traditionally accepted methods to reinvent how MEMS are manufactured. Our process IP results in a MEMS topology that simplifies the assembly process to improve the performance of sensor applications. By using our approach, you can build leading-edge MEMS sensing technology at low cost and high performance.

To apply, please send your resume and cover letter to careers@omnitronsensors.com

Role Description
We are looking to add on our team an experienced Senior Packaging Engineer who can lead and provide technical expertise for the design and implementation of novel optical MEMS packaging technologies for high-volume manufacturing. Candidates will be expected to offer creative insights for R&D problems, characterize and define package, and help execute manufacturing and prototyping of designs with suppliers. Experience in optical MEMS devices is required.

Responsibilities

• Design and implementation of MEMS packaging technology for high-volume manufacturing
• Development of Finite Element Analysis (FEA) models for simulating and predicting sensor behavior due to package influences
• Create, conduct, & analyze Design of Experiments (DOE) for development activities.
• Support process integration, yield improvement, design for manufacturability, & design for reliability.
• Actively interface with key US and international suppliers with the goal of developing & improving upon existing package solutions to volume production
• Manage material logistics for experimental needs

Qualifications & Requirements

• BS/MS degree in Mechanical, Chemical, or Materials Science Engineering
• 5 to 10 years of industrial experience in the field of microelectronics and/or MEMS / Optical MEMS packaging especially with Ceramic Leadless Chip Carrier (CLCC), Land Grid Array (LGA), and Chip-Scale Package (CSP).
• Experienced in material selection and high-volume IC/ MEMS assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount)
• Demonstrated experience in FEA modeling and implementing practical solutions for package stress reduction.
• Strong hands-on experience with design layout tools (AutoCAD, SolidWorks, Altium etc.)
• Knowledge of fundamentals of Optical MEMS sensors – operation, characterization techniques and practical applications.
• Experience in failure analysis methodologies
• Six Sigma Green Belt certification (black-belt preferred).
• Location: Onsite in Santa Clara, CA

Desired Characteristics & Attributes

• Experience and proven skills in written and oral communication of technical material, technical leadership and coordination of multi-site cross-functional team/partner efforts.
• Self-motivation, out-of-the-box thinking, and ability to work effectively, create solutions, and achieve success under the constraints of a fast-paced start-up company environment.
• Ability to work well with others in a collaborative team environment

What We Offer

• Competitive salary and equity compensation
• High-quality individual and family medical, dental, and vision insurance
• Unlimited vacation
• Professional development reimbursement
• Visa sponsorship and support